Halvleder-mikrochip
For alternative betydninger, se Chip.
![](http://upload.wikimedia.org/wikipedia/commons/thumb/7/77/Two_bipolar_transistorchips_in_a_house.jpg/220px-Two_bipolar_transistorchips_in_a_house.jpg)
![](http://upload.wikimedia.org/wikipedia/commons/thumb/a/a1/Wafer_2_Zoll_bis_8_Zoll.jpg/220px-Wafer_2_Zoll_bis_8_Zoll.jpg)
![](http://upload.wikimedia.org/wikipedia/commons/thumb/5/5d/Silicon_wafer_with_mirror_finish.jpg/220px-Silicon_wafer_with_mirror_finish.jpg)
En halvleder-mikrochip eller halvlederbrik[1] (kortere mikrochip, chip; engelsk: Die[2][3]) er indenfor halvlederteknologi betegnelsen for selve halvlederkomponenten uden hus. En halvlederskive skæres med en diamant og brækkes op til de små halvleder-mikrochips efter endt forarbejdning (bl.a. litografi dotering, metalisering...).
Mange halvlederkomponenter er baseret på silicium og deres chips eller brikker kan så kaldes silicium-chips eller siliciumbrikker.
En halvleder-mikrochip kan f.eks. være forarbejdet til:
Kilder/referencer
- ^ Halvlederbrik anvendt her: 28. feb 1986, ing.dk: Større lagerchip kræver ny teknik Citat: "... En DRAM (Dynamic Ramdom Access Memory) er den form for halvlederbrik (chip), der udgør arbejdslageret i praktisk taget alle datamaskiner fra lommeregnere til superdatamater...", backup
- ^ pcmag.com: Die Citat: "...An unpackaged, bare chip...The terms die and chip are often used synonymously...", backup
- ^ Graham Neil: Time is right for bare die. In: European Semiconductor. 27, Nr. 11, 2005, Seiten 11–12: Citat: "...The technology has made significant advances over the years, however the fact remains that the actual silicon Die in the package is much smaller, lighter and has less mass than a packaged part itself...", backup
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Forfatter/Opretter: No machine-readable author provided. Glenn assumed (based on copyright claims)., Licens: CC BY-SA 3.0
The image shows the transistor chips themselves - 1 by 1 mm. The lines at the top are millimeter spaced. The house they are in are TO39 or TO5 like.
Pay attention to the four small bonding wires that are welded on the chips and on the terminals glued in the red-blackish matter. The two small rectangular plates where the chips are placed, are normally the collector terminals.Silicon wafer with mirror finish
Forfatter/Opretter: unknown, Licens: CC BY-SA 3.0